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SK Hynix recently announced that it will use a more environmentally friendly gas - fluorine gas (F2) - in its chip production cleaning process.
SK Hynix 2024 Sustainability report shows that nitrogen trifluoride (NF3), which the company originally used as a cleaning process in chip production to remove residues formed in the chamber during deposition, has a significantly higher global warming potential (GWP) than fluorine gas (GWP of 17200 for NF3 and 0 for F2).
In addition to this, SK Hynix has further increased the use of hydrofluoric acid (HF) (which can be used in cryogenic etching equipment), which has a GWP of 1 or lower, much lower than the fluorocarbon gases used in the past for NAND channel hole etching.